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With the rapid advancement of artificial intelligence technologies, the power demands of AI servers have reached unprecedented levels. Matrix Power is at the forefront of addressing these challenges with our innovative BBS AI Power series, designed specifically for the next generation of AI computing infrastructure.

Surging Demand and Challenges in AI Server Power Systems

With the widespread adoption of NVIDIA's Blackwell architecture GPUs (e.g., GB200, NVL72 racks), AI server rack power has exceeded 120kW, and the upcoming Rubin Ultra era is projected to surpass 1000kW. This trend imposes three critical requirements on power systems:

BBS AI Power's Innovative Solutions

Matrix MPT introduces the BBS AI Power series, a tailored PSU and BBU system for AI servers, featuring cutting-edge technologies that address the unique challenges of AI computing infrastructure.

1. Intelligent Power Shelf Unit (PSU)

Our advanced PSU solutions incorporate several groundbreaking technologies:

• Topology Optimization: Utilizes HVDC architecture to minimize AC/DC conversion loss, achieving 98.2% efficiency.
• Advanced Materials: Integrates SiC (Silicon Carbide) and GaN (Gallium Nitride) power devices, supporting 2700W single-chip power delivery (e.g., GB200 GPU).
• Dynamic Load Management: AI-driven voltage rail adjustment meets peak demands of HPC/AI servers.

2. High-Reliability Backup Battery Unit (BBU)

Our BBU solutions ensure uninterrupted power supply for critical AI computing tasks:

• 3D Stacked Battery Array: Boosts energy density by 40%, enabling 10-minute full-load backup for 120kW racks.
• Chip-Level Protection: Embedded Infineon eFuse ensures μs-level fault isolation.
• Hot-Swap Compatibility: Complies with OCP ORV3 standards, compatible with NVIDIA's Kyber rack architecture.

Future Roadmap

With Rubin Ultra GPUs on the horizon, BBS AI Power plans to launch next-generation solutions that will further revolutionize AI server power systems:

• Liquid-Cooled PSUs for ultra-high-density racks, addressing the extreme thermal challenges of next-generation AI processors.
• All-Solid-State BBUs to align with 3D-stacked rack designs, offering unprecedented power density and reliability.